MEMS Technology Solutions
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Table of Contents
The software is divided into modules, sections and topics. There are five modules namely mechanics, sensing, actuation, process and data analysis. Each module is divided into sections which is further divided into topics. Every topic has a corresponding help file which will be hyperlinked. The topic title and a short description are listed here.
Mechanics
  • Structures
  • Vibration
    • Free vibration
    • Forced vibration
      • Constant force - Forced vibration under a constant force with damping
      • Harmonic force - Forced vibration under a harmonic force with damping
      • Base excitation - Forced vibration driven by base excitation with damping
  • Damping
    • Squeeze film
    • Slide film
  • Fluidics
    • Microchannels
      • No Slip
        • Circle - Design of a circular microfluidic channel
        • Square - Design of a microfluidic channel with square cross section
        • Rectangle -Design of a microfluidic channel with rectangular crosssection
        • Triangle - Design of a microfluidic channel with triangular cross section
        • Parabola - Design of a microfluidic channel with parabolic cross section
      • With Slip
        • Rectangle - Fluid flow in a wide rectangular channel with slip
    • Diffusion
      • Diffusion coefficient - Estimate diffusion coefficient of spherical bodies in a solvent
      • Spreading
      • Mixing
        • T-mixer - Design of a T-shaped microfluidic mixer
      • Separation
        • H-filter - Separation of solutes using H-filter

  • Sensing
    • Piezoresistive
    • Capacitive
      • Acceleration
        • Static signal - Capacitive accelerometer for sensing a static signal
        • Step signal - Capacitive accelerometer for sensing a step signal
        • Pulse signal - Capacitive accelerometer for sensing a pulse signal
    • Piezoelectric
      • Acceleration
        • Inertial mass - Piezoelectric accelerometer under longitudinal load
        • Thin film - Thin film based piezoelectric accelerometer

  • Actuation
    • Electrostatic
    • Thermal
      • Bimetallic - Design of a cantilever based bimetallic thermal actuator
      • Bimorph - Design of a thermal bimorph actuator
      • Bent beam - Design of a thermal bent beam actuator - chevron
    • Piezoelectric
      • Longitudinal - Design of a longitudinal piezoelectric actuator
      • Transverse - Design of a transverse piezoelectric actuator

  • Process
    • Lithography
      • Spin resist - Spin coating of a thin film of photoresist
    • Oxidation
    • Diffusion
      • Diffusion - Diffusion profile for pre-deposition and drive-in in silicon
      • Diffusion mask - Silicon dioxide mask for high temperature diffusion
    • Implantation
      • Implantation - Ion implantation and drive-in of dopants in silicon
      • Implant mask - Mask thickness for selective implantation of dopants
    • Film Deposition
      • Film stress - Thin film stress calculated from wafer bow measurements
      • Metal
        • Evaporation - Deposition rate of metals using E-beam planetary evaporator
      • Polysilicon - Deposition rate of polysilicon using silane in a low pressure reactor
    • Wet etching
      • KOH etching - Etch rate of silicon and silicon dioxide in KOH
        • Membrane etch - Determine size of mask opening for membrane etch using KOH
      • Phosphoric acid - Etch rate of silicon nitride and silicon dioxide in phosphoric acid
      • Buffered HF - Etch rate of thermal oxide in buffered hydrofluoric acid (BOE)

  • Data Analysis
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